Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly

Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with d...

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Bibliographic Details
Main Author: Periannan Arulvanan.
Other Authors: Zhong, Zhao Wei
Format: Theses and Dissertations
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/6271
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Institution: Nanyang Technological University
Description
Summary:Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. Material characterization and process validation was carried out.