Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly

Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly

Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with d...

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Main Author: Periannan Arulvanan.
Other Authors: Zhong, Zhao Wei
Format: Theses and Dissertations
Published: 2008
Subjects:
DRNTU::Engineering::Manufacturing::Production management
Online Access:http://hdl.handle.net/10356/6271
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Institution: Nanyang Technological University
id sg-ntu-dr.10356-6271
record_format dspace
spelling sg-ntu-dr.10356-62712023-03-11T17:40:59Z Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly Periannan Arulvanan. Zhong, Zhao Wei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing::Production management Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. Material characterization and process validation was carried out. Master of Science (Mechanics & Processing of Materials) 2008-09-17T11:10:45Z 2008-09-17T11:10:45Z 2004 2004 Thesis http://hdl.handle.net/10356/6271 Nanyang Technological University application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
topic DRNTU::Engineering::Manufacturing::Production management
spellingShingle DRNTU::Engineering::Manufacturing::Production management
Periannan Arulvanan.
Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
description Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. Material characterization and process validation was carried out.
author2 Zhong, Zhao Wei
author_facet Zhong, Zhao Wei
Periannan Arulvanan.
format Theses and Dissertations
author Periannan Arulvanan.
author_sort Periannan Arulvanan.
title Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
title_short Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
title_full Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
title_fullStr Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
title_full_unstemmed Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
title_sort lead-free pcb assembly and effect of solder joint profile on the reliability of pcb assembly
publishDate 2008
url http://hdl.handle.net/10356/6271
_version_ 1761781997367197696

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