Thermal management of integrated electronics

With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the...

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Main Author: Koh, Sheilina Yu Fang
Other Authors: Tan Chuan Seng
Format: Final Year Project
Language:English
Published: 2015
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Online Access:http://hdl.handle.net/10356/63871
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-638712023-07-07T15:55:18Z Thermal management of integrated electronics Koh, Sheilina Yu Fang Tan Chuan Seng School of Electrical and Electronic Engineering Singapore-MIT Alliance Programme DRNTU::Engineering::Electrical and electronic engineering::Microelectronics With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the performance of the IC to be unreliable. The cooling method that is chosen must be able to dissipate heat fluxes that are above 100W/cm2 with the operating temperature not exceeding 80°C. Thus, it is essential to remove heat efficiently that is dissipated which may potentially cause damage to the IC. In order to cool the IC efficiently, various technologies are explored. The technologies are liquid cooling using microchannels, use of heat pipes, thermoelectric cooling, metal vapor chamber, etc. The technology that is used in this project is metal vapor chamber. This technology is chosen as it has been studied extensively and possesses superior heat dissipation capabilities than the others. A vapor chamber consists of evaporator with a heat source, condenser with a heat sink and an adiabatic section. The author has worked with the research team at Singapore-MIT Alliance for Research and Technology with regard to this problem. Through this report, the author will present the thermal management technique chosen and discuss the results obtained with the use of micropillar arrays. Different geometries (e.g. micropillar height, pitch, diameter and array length) fabricated on wick length of 1.0 cm were investigated. The samples were tested in sealed vapor chamber environment. This was done in the analytic model developed by the team at SMART. As the setup has its limitation, the author could capture the data during the experiment qualitatively. In order for efficient heat removal, higher pillar diameter/ pitch ratio, higher aspect ratio and low wick array lengths are required. Bachelor of Engineering 2015-05-19T08:34:39Z 2015-05-19T08:34:39Z 2015 Final Year Project (FYP) http://hdl.handle.net/10356/63871 en Nanyang Technological University 56 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Koh, Sheilina Yu Fang
Thermal management of integrated electronics
description With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the performance of the IC to be unreliable. The cooling method that is chosen must be able to dissipate heat fluxes that are above 100W/cm2 with the operating temperature not exceeding 80°C. Thus, it is essential to remove heat efficiently that is dissipated which may potentially cause damage to the IC. In order to cool the IC efficiently, various technologies are explored. The technologies are liquid cooling using microchannels, use of heat pipes, thermoelectric cooling, metal vapor chamber, etc. The technology that is used in this project is metal vapor chamber. This technology is chosen as it has been studied extensively and possesses superior heat dissipation capabilities than the others. A vapor chamber consists of evaporator with a heat source, condenser with a heat sink and an adiabatic section. The author has worked with the research team at Singapore-MIT Alliance for Research and Technology with regard to this problem. Through this report, the author will present the thermal management technique chosen and discuss the results obtained with the use of micropillar arrays. Different geometries (e.g. micropillar height, pitch, diameter and array length) fabricated on wick length of 1.0 cm were investigated. The samples were tested in sealed vapor chamber environment. This was done in the analytic model developed by the team at SMART. As the setup has its limitation, the author could capture the data during the experiment qualitatively. In order for efficient heat removal, higher pillar diameter/ pitch ratio, higher aspect ratio and low wick array lengths are required.
author2 Tan Chuan Seng
author_facet Tan Chuan Seng
Koh, Sheilina Yu Fang
format Final Year Project
author Koh, Sheilina Yu Fang
author_sort Koh, Sheilina Yu Fang
title Thermal management of integrated electronics
title_short Thermal management of integrated electronics
title_full Thermal management of integrated electronics
title_fullStr Thermal management of integrated electronics
title_full_unstemmed Thermal management of integrated electronics
title_sort thermal management of integrated electronics
publishDate 2015
url http://hdl.handle.net/10356/63871
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