Thermal management of integrated electronics

• Main Author: Koh, Sheilina Yu Fang
• Other Authors: Tan Chuan Seng
• Format: Final Year Project
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
• Online Access: http://hdl.handle.net/10356/63871
• Institution: Nanyang Technological University

With technology advancing exponentially, sizes of these electronic devices are decreasing as well. As the sizes decreases, the area for heat dissipation will be smaller. This will in turn lead to a rise in temperature which the integrated circuit (IC) may not be able to withstand. This may cause the...