Micro-wire joining design setup and testing
Wire sawing technology is one of the Free Abrasive Machining (FAM) techniques in order to cut very thin wafers from large diameter ingots of crystalline semiconductor material (Silicon) used in semi-conductor industry for the production of solar cells. The process has many advan...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/10356/64977 |
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| Institution: | Nanyang Technological University |
| Language: | English |