Micro-wire joining design setup and testing

• Main Author: Natarajan Nishanth
• Other Authors: David Lee Butler
• Format: Theses and Dissertations
• Language: English
• Published: 2015
• Subjects: DRNTU::Engineering::Mechanical engineering
• Online Access: http://hdl.handle.net/10356/64977
• Institution: Nanyang Technological University

Wire sawing technology is one of the Free Abrasive Machining (FAM) techniques in order to cut very thin wafers from large diameter ingots of crystalline semiconductor material (Silicon) used in semi-conductor industry for the production of solar cells. The process has many advan...