Wire bond process development for low K (dielectric constant) materials
Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism...
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| Format: | Theses and Dissertations |
| Published: |
2008
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| Online Access: | http://hdl.handle.net/10356/6500 |
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| Institution: | Nanyang Technological University |
| Summary: | Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism will be established. |
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