Wire bond process development for low K (dielectric constant) materials
Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism...
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2008
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| Online Access: | http://hdl.handle.net/10356/6500 |
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sg-ntu-dr.10356-65002023-03-11T17:23:55Z Wire bond process development for low K (dielectric constant) materials Tan, Jonathan Yang Kern. Zhong, Zhaowei School of Mechanical and Production Engineering DRNTU::Engineering::Manufacturing Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism will be established. Master of Science (Precision Engineering) 2008-09-17T11:16:33Z 2008-09-17T11:16:33Z 2004 2004 Thesis http://hdl.handle.net/10356/6500 Nanyang Technological University application/pdf |
| institution |
Nanyang Technological University |
| building |
NTU Library |
| continent |
Asia |
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Singapore Singapore |
| content_provider |
NTU Library |
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DR-NTU |
| topic |
DRNTU::Engineering::Manufacturing |
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DRNTU::Engineering::Manufacturing Tan, Jonathan Yang Kern. Wire bond process development for low K (dielectric constant) materials |
| description |
Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism will be established. |
| author2 |
Zhong, Zhaowei |
| author_facet |
Zhong, Zhaowei Tan, Jonathan Yang Kern. |
| format |
Theses and Dissertations |
| author |
Tan, Jonathan Yang Kern. |
| author_sort |
Tan, Jonathan Yang Kern. |
| title |
Wire bond process development for low K (dielectric constant) materials |
| title_short |
Wire bond process development for low K (dielectric constant) materials |
| title_full |
Wire bond process development for low K (dielectric constant) materials |
| title_fullStr |
Wire bond process development for low K (dielectric constant) materials |
| title_full_unstemmed |
Wire bond process development for low K (dielectric constant) materials |
| title_sort |
wire bond process development for low k (dielectric constant) materials |
| publishDate |
2008 |
| url |
http://hdl.handle.net/10356/6500 |
| _version_ |
1761781231060516864 |