Electromigration study of copper interconnects with side reservoir design

• Main Author: Mario, Hendro
• Other Authors: Gan Chee Lip
• Format: Theses and Dissertations
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/66475
• Institution: Nanyang Technological University

Reliability issues in copper interconnect/low-k dielectric system, namely electromigration and TDDB (Time Dependent Dielectric Breakdown), have become more crucial as the dimensions of the copper interconnect structures keep shrinking with the technology node. In this project, a new method to mitiga...