Development of 3D electro-optical integration based on silicon photonic TSV interposer

Silicon photonics has been intensively researched and investigated as it provides a low-cost and power efficient solution for next generation interconnect technology based on on-chip, chip-to-chip, and long-haul optical communication. A multifunctional platform requires photonic integrated circuits...

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Bibliographic Details
Main Author: Yang, Yan
Other Authors: Rusli
Format: Theses and Dissertations
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/67281
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Institution: Nanyang Technological University
Language: English