Development of 3D electro-optical integration based on silicon photonic TSV interposer

• Main Author: Yang, Yan
• Other Authors: Rusli
• Format: Theses and Dissertations
• Language: English
• Published: 2016
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/67281
• Institution: Nanyang Technological University

Silicon photonics has been intensively researched and investigated as it provides a low-cost and power efficient solution for next generation interconnect technology based on on-chip, chip-to-chip, and long-haul optical communication. A multifunctional platform requires photonic integrated circuits...