Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes.
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2008
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| Online Access: | http://hdl.handle.net/10356/6796 |
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| Institution: | Nanyang Technological University |