Report on industrial attachment with Micron Semiconductor Asia Pte Ltd
This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes.
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sg-ntu-dr.10356-67962023-03-04T15:40:24Z Report on industrial attachment with Micron Semiconductor Asia Pte Ltd Lao, Luciana Lisa. School of Materials Science & Engineering DRNTU::Engineering::Materials This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes. 2008-09-17T14:27:22Z 2008-09-17T14:27:22Z 2002 2002 Industrial Attachment (IA) http://hdl.handle.net/10356/6796 Nanyang Technological University 126 p. application/pdf |
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DRNTU::Engineering::Materials Lao, Luciana Lisa. Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
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This report emphazised on the two projects assigned to author during IA. The projects are Die Mount Evaluation of New Flip Chip Package and Materials Characterization and Evaluation on Adhesive Tapes. |
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School of Materials Science & Engineering |
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School of Materials Science & Engineering Lao, Luciana Lisa. |
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Industrial Attachment (IA) |
author |
Lao, Luciana Lisa. |
author_sort |
Lao, Luciana Lisa. |
title |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_short |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_full |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_fullStr |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_full_unstemmed |
Report on industrial attachment with Micron Semiconductor Asia Pte Ltd |
title_sort |
report on industrial attachment with micron semiconductor asia pte ltd |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/6796 |
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1759853582148960256 |