Development of high performance heat sink for power electronics

Thermal management in the field of electronic devices has become a challenge due to the recent miniaturization trend, which results in an inevitable increase in power density requirement. Moreover conventional cooling technologies may not maintain a low junction temperature required for the chip. In...

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Bibliographic Details
Main Author: Sakanova, Assel
Other Authors: Tseng King Jet
Format: Theses and Dissertations
Language:English
Published: 2016
Subjects:
Online Access:http://hdl.handle.net/10356/68872
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Institution: Nanyang Technological University
Language: English
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