Development of high performance heat sink for power electronics
Thermal management in the field of electronic devices has become a challenge due to the recent miniaturization trend, which results in an inevitable increase in power density requirement. Moreover conventional cooling technologies may not maintain a low junction temperature required for the chip. In...
Saved in:
Main Author: | |
---|---|
Other Authors: | |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2016
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/68872 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Be the first to leave a comment!