Carbon-based materials for thermal management applications
The scaling down of device sizes and the increasing in power dissipation make heat transport and removal a major technological impediment to the future development for electronic applications. Limited heat conduction within devices causes severe localized self-heating problems. Temperature increase...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2018
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/73962 |
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| 機構: | Nanyang Technological University |
| 語言: | English |