Carbon-based materials for thermal management applications

• Main Author: Kong, Qinyu
• Other Authors: Tay Beng Kang
• Format: Theses and Dissertations
• Language: English
• Published: 2018
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: http://hdl.handle.net/10356/73962
• Institution: Nanyang Technological University

The scaling down of device sizes and the increasing in power dissipation make heat transport and removal a major technological impediment to the future development for electronic applications. Limited heat conduction within devices causes severe localized self-heating problems. Temperature increase...