Carbon-based materials for thermal management applications

• المؤلف الرئيسي: Kong, Qinyu
• مؤلفون آخرون: Tay Beng Kang
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2018
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: http://hdl.handle.net/10356/73962
• المؤسسة: Nanyang Technological University

The scaling down of device sizes and the increasing in power dissipation make heat transport and removal a major technological impediment to the future development for electronic applications. Limited heat conduction within devices causes severe localized self-heating problems. Temperature increase...