Injection compression moulding (ICM) process development for the warpage and stress reduction on polymeric microfluidic chip applications
The vast range of applications of microfluidic chips has propelled the growth of the microfluidic industry for thinner, more precise and complex microfluidic chips, thus the need for high precision fabrication technique capable of mass fabrication grows with this rising demand. Hesitation effects an...
Saved in:
Main Author: | Lee, Jia Min |
---|---|
Other Authors: | Zhong Zhaowei |
Format: | Final Year Project |
Language: | English |
Published: |
2018
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/75695 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Injection Compression Molding (ICM) process development for the warpage and stress reduction on polymeric microfluidic chip applications
by: Ler, Wan Him
Published: (2020) -
NUMERICAL ANALYSIS PREDICTION ON SHRINKAGE AND WARPAGE IN INJECTION MOLDING PROCESS
by: Harjanto, Syaiful -
Fabrication of microfluidic droplet former.
by: Chye, Jessica Yan Mei.
Published: (2012) -
Fabrication of microfluidic droplet former II.
by: Yew, Jeanette Si Yang.
Published: (2012) -
Rapid Tooling For Powder Injection Moulding Process
by: Muhammad Aslam, et al.
Published: (2016)