Mechanical characterizations of high temperature polymer encapsulation

The development of a new high temperature polymer is the key to achieving high reliability operations in aerospace and well-logging applications as conventional encapsulation materials such as epoxy, polyimide or silicone do not suffice in high pressure high temperature (HPHT) environment. In...

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Bibliographic Details
Main Author: Chan, Wei Hao
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: 2018
Subjects:
Online Access:http://hdl.handle.net/10356/75915
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Institution: Nanyang Technological University
Language: English
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