Optimization of thermal imaging techniques in failure analysis
Lock-in thermography (LIT) has been gaining more attention from the research community for non-destructive evaluation of integrated circuits (IC) and localization of thermal active electrical defects in microelectronics and circuit reliability research. Thermal imaging is considered to be the standa...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2019
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| Online Access: | http://hdl.handle.net/10356/76873 |
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| Institution: | Nanyang Technological University |
| Language: | English |