Optimization of thermal imaging techniques in failure analysis
Lock-in thermography (LIT) has been gaining more attention from the research community for non-destructive evaluation of integrated circuits (IC) and localization of thermal active electrical defects in microelectronics and circuit reliability research. Thermal imaging is considered to be the standa...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2019
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| Online Access: | http://hdl.handle.net/10356/76873 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Lock-in thermography (LIT) has been gaining more attention from the research community for non-destructive evaluation of integrated circuits (IC) and localization of thermal active electrical defects in microelectronics and circuit reliability research. Thermal imaging is considered to be the standard technology in the field of IC failure analysis. This thesis presents the following: 1) optimization scheme for thermal imaging techniques is proposed to calibrate with the LIT and identify the root cause of the failure in IC packages, 2) ultra-violet (UV) thermal imaging technique is introduced with LIT for failure analysis. Experiments are conducted under real-world environment. The results show that the proposed optimization techniques improves both the validation time and accuracy of the conventional thermal imaging techniques for the failure analysis. Furthermore, an investigation is carried out to identify the potential of UV thermal imaging LIT for the failure analysis. |
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