Semiconductor intellectual property (IP) optimization for design for manufacturability

GLOBALFOUNDRIES is full-service semiconductor foundries that offer technology footprint and a truly global manufacturing. By collaboration and innovation it is realizing the vision of reshaping the semiconductor industry. GLOBALFOUNDRIES offers superior manufacturing, a unique combination of advance...

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Main Author: Lua, Boon Hong
Other Authors: Wang Qijie
Format: Final Year Project
Language:English
Published: 2019
Subjects:
Online Access:http://hdl.handle.net/10356/77455
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-774552023-07-07T16:44:46Z Semiconductor intellectual property (IP) optimization for design for manufacturability Lua, Boon Hong Wang Qijie School of Electrical and Electronic Engineering DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits GLOBALFOUNDRIES is full-service semiconductor foundries that offer technology footprint and a truly global manufacturing. By collaboration and innovation it is realizing the vision of reshaping the semiconductor industry. GLOBALFOUNDRIES offers superior manufacturing, a unique combination of advanced technology and global operations. Lithography is one of the key modules in the wafer fabrication process, and OPC (optical proximity correction) is an inevitable step before lithography. Design for manufacturing (DFM) refers to the actions taken during the physical design phase of IC development to ensure accurate manufacturing of the design. Most of the defects in the IC manufacturing process are due to over-processing steps during the lithographic printing steps or random particles interrupting the flow of light through the layout mask. The diffraction effect becomes significant when the light is interacting with the object and the slit approaches the dimensions of the light wavelength. Semiconductor manufacturing has far exceeded this threshold. High-resolution enhancement techniques such as optical proximity correction (OPC) were able to resolve distortions caused by diffraction effects. However, OPC generated by system calculated may cause defect in manufacturing process. So, OPC optimization for manufacture process is necessary to minimize the defect concern. Bachelor of Engineering (Electrical and Electronic Engineering) 2019-05-29T05:42:34Z 2019-05-29T05:42:34Z 2019 Final Year Project (FYP) http://hdl.handle.net/10356/77455 en Nanyang Technological University 53 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Lua, Boon Hong
Semiconductor intellectual property (IP) optimization for design for manufacturability
description GLOBALFOUNDRIES is full-service semiconductor foundries that offer technology footprint and a truly global manufacturing. By collaboration and innovation it is realizing the vision of reshaping the semiconductor industry. GLOBALFOUNDRIES offers superior manufacturing, a unique combination of advanced technology and global operations. Lithography is one of the key modules in the wafer fabrication process, and OPC (optical proximity correction) is an inevitable step before lithography. Design for manufacturing (DFM) refers to the actions taken during the physical design phase of IC development to ensure accurate manufacturing of the design. Most of the defects in the IC manufacturing process are due to over-processing steps during the lithographic printing steps or random particles interrupting the flow of light through the layout mask. The diffraction effect becomes significant when the light is interacting with the object and the slit approaches the dimensions of the light wavelength. Semiconductor manufacturing has far exceeded this threshold. High-resolution enhancement techniques such as optical proximity correction (OPC) were able to resolve distortions caused by diffraction effects. However, OPC generated by system calculated may cause defect in manufacturing process. So, OPC optimization for manufacture process is necessary to minimize the defect concern.
author2 Wang Qijie
author_facet Wang Qijie
Lua, Boon Hong
format Final Year Project
author Lua, Boon Hong
author_sort Lua, Boon Hong
title Semiconductor intellectual property (IP) optimization for design for manufacturability
title_short Semiconductor intellectual property (IP) optimization for design for manufacturability
title_full Semiconductor intellectual property (IP) optimization for design for manufacturability
title_fullStr Semiconductor intellectual property (IP) optimization for design for manufacturability
title_full_unstemmed Semiconductor intellectual property (IP) optimization for design for manufacturability
title_sort semiconductor intellectual property (ip) optimization for design for manufacturability
publishDate 2019
url http://hdl.handle.net/10356/77455
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