Industrial attachment report with Micron Semiconductor Asia Pte Ltd
Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out.
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sg-ntu-dr.10356-80402023-03-04T15:30:26Z Industrial attachment report with Micron Semiconductor Asia Pte Ltd Airin Alamsjah Ang, Hock Eng School of Mechanical and Production Engineering DRNTU::Engineering::Materials Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out. 2008-09-19T01:55:30Z 2008-09-19T01:55:30Z 2003 2003 Industrial Attachment (IA) http://hdl.handle.net/10356/8040 Nanyang Technological University 93 p. application/pdf |
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DRNTU::Engineering::Materials Airin Alamsjah Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
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Two projects were performed: (1) involves verification of PBGA solder ball shear strength trend in terms of 2 pads designs, Solder Mask Defined and Non-Solder Mask Defined; (2) focus on module level reliability check out. |
author2 |
Ang, Hock Eng |
author_facet |
Ang, Hock Eng Airin Alamsjah |
format |
Industrial Attachment (IA) |
author |
Airin Alamsjah |
author_sort |
Airin Alamsjah |
title |
Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
title_short |
Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
title_full |
Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
title_fullStr |
Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
title_full_unstemmed |
Industrial attachment report with Micron Semiconductor Asia Pte Ltd |
title_sort |
industrial attachment report with micron semiconductor asia pte ltd |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/8040 |
_version_ |
1759853603484336128 |