Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes

8 p.

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Main Authors:	Zhu, Binbin, Liu, Wei, Lu, Shunpeng, Zhang, Yiping, Hasanov, Namig, Zhang, Xueliang, Ji, Yun, Zhang, Zi-Hui, Tan, Swee Tiam, Liu, Hongfei, Demir, Hilmi Volkan
Other Authors:	School of Electrical and Electronic Engineering
Format:	Article
Language:	English
Published:	2017
Subjects:	Ohmic contact Decoupled
Online Access:	https://hdl.handle.net/10356/81889 http://hdl.handle.net/10220/42288
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Institution:	Nanyang Technological University
Language:	English

id	sg-ntu-dr.10356-81889
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spelling	sg-ntu-dr.10356-818892023-02-28T19:22:18Z Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes Zhu, Binbin Liu, Wei Lu, Shunpeng Zhang, Yiping Hasanov, Namig Zhang, Xueliang Ji, Yun Zhang, Zi-Hui Tan, Swee Tiam Liu, Hongfei Demir, Hilmi Volkan School of Electrical and Electronic Engineering School of Physical and Mathematical Sciences Ohmic contact Decoupled 8 p. In the conventional fabrication process of the widely-adopted Ni/Ag/Ti/Au reflector for InGaN/GaN-based flip-chip light-emitting diodes (LEDs), the contact and the mirror are entangled together with contrary processing conditions which set constraints to the device performance severely. Here we first report the concept and its effectiveness of decoupling the contact formation and the mirror construction. The ohmic contact is first formed by depositing and annealing an extremely thin layer of Ni/Ag on top of p-GaN. The mirror construction is then carried out by depositing thick layer of Ag/Ti/Au without any annealing. Compared with the conventional fabrication method of the reflector, by which the whole stack of Ni/Ag/Ti/Au is deposited and annealed together, the optical output power is improved by more than 70% at 350 mA without compromising the electrical performance. The mechanism of decoupling the contact and the mirror is analyzed with the assistance of contactless sheet resistance measurement and secondary ion mass spectrometry (SIMS) depth profile analysis. NRF (Natl Research Foundation, S’pore) Accepted Version 2017-04-19T05:32:45Z 2019-12-06T14:42:25Z 2017-04-19T05:32:45Z 2019-12-06T14:42:25Z 2016 2016 Journal Article Zhu, B., Liu, W., Lu, S., Zhang, Y., Hasanov, N., Zhang, X., et al. (2016). Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes. Journal of Physics D: Applied Physics, 49(26), 265106-. 0022-3727 https://hdl.handle.net/10356/81889 http://hdl.handle.net/10220/42288 10.1088/0022-3727/49/26/265106 197830 en Journal of Physics D: Applied Physics © 2016 IOP Publishing Ltd. This is the author created version of a work that has been peer reviewed and accepted for publication by Journal of Physics D: Applied Physics, IOP Publishing Ltd. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1088/0022-3727/49/26/265106]. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
language	English
topic	Ohmic contact Decoupled
spellingShingle	Ohmic contact Decoupled Zhu, Binbin Liu, Wei Lu, Shunpeng Zhang, Yiping Hasanov, Namig Zhang, Xueliang Ji, Yun Zhang, Zi-Hui Tan, Swee Tiam Liu, Hongfei Demir, Hilmi Volkan Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
description	8 p.
author2	School of Electrical and Electronic Engineering
author_facet	School of Electrical and Electronic Engineering Zhu, Binbin Liu, Wei Lu, Shunpeng Zhang, Yiping Hasanov, Namig Zhang, Xueliang Ji, Yun Zhang, Zi-Hui Tan, Swee Tiam Liu, Hongfei Demir, Hilmi Volkan
format	Article
author	Zhu, Binbin Liu, Wei Lu, Shunpeng Zhang, Yiping Hasanov, Namig Zhang, Xueliang Ji, Yun Zhang, Zi-Hui Tan, Swee Tiam Liu, Hongfei Demir, Hilmi Volkan
author_sort	Zhu, Binbin
title	Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
title_short	Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
title_full	Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
title_fullStr	Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
title_full_unstemmed	Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
title_sort	decoupling contact and mirror: an effective way to improve the reflector for flip-chip ingan/gan-based light-emitting diodes
publishDate	2017
url	https://hdl.handle.net/10356/81889 http://hdl.handle.net/10220/42288
_version_	1759854487022862336

Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes

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