Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100 nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNTs solder materials – as well as the effect of the size of the CNTs. It was found that all the CNTs-doped composi...

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Main Authors: Zhu, Ze, Chan, Yan-Cheong, Chen, Zhong, Gan, Chee-Lip, Wu, Fengshun
Format: Article
Language:English
Published: 2019
Subjects:
Online Access:https://hdl.handle.net/10356/85249
http://hdl.handle.net/10220/49190
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-852492020-03-07T11:53:49Z Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder Zhu, Ze Chan, Yan-Cheong Chen, Zhong Gan, Chee-Lip Wu, Fengshun Solder Joints Carbon Nanotubes (CNTs) Engineering::Materials Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100 nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNTs solder materials – as well as the effect of the size of the CNTs. It was found that all the CNTs-doped composite solder samples displayed refined microstructure, inhibited interfacial intermetallic compound (IMC) growth, and reinforced mechanical strength – while the melting point of the composite solder was close to that of the pristine solder. The reinforcement in mechanical strength was due to the doped CNTs pinned at the solder grain boundaries, which acted as second-phase particles that refined the microstructure and increased the dislocation density. The adsorbed CNTs destroyed the integrity of the interfacial IMCs, leading to reduced growth rate. Among these composite solders, CNTs with a diameter of 40–60 nm provided superior performance in refining the microstructure, lowering the IMC growth rate by 30.9% – and reinforcing the ball shear strength by 15.3% and the hardness by 16.1%. This size effect on the performance of composite solders was due to the various surface energy values for CNTs – that led to the agglomeration and adsorption of CNTs in the solder matrix and interfacial IMCs. 2019-07-09T02:37:04Z 2019-12-06T16:00:24Z 2019-07-09T02:37:04Z 2019-12-06T16:00:24Z 2018 Journal Article Zhu, Z., Chan, Y.-C., Chen, Z., Gan, C.-L., & Wu, F. (2018). Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder. Materials Science and Engineering: A, 727, 160-169. doi:10.1016/j.msea.2018.05.002 0921-5093 https://hdl.handle.net/10356/85249 http://hdl.handle.net/10220/49190 10.1016/j.msea.2018.05.002 en Materials Science and Engineering: A © 2018 Elsevier B.V. All rights reserved.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic Solder Joints
Carbon Nanotubes (CNTs)
Engineering::Materials
spellingShingle Solder Joints
Carbon Nanotubes (CNTs)
Engineering::Materials
Zhu, Ze
Chan, Yan-Cheong
Chen, Zhong
Gan, Chee-Lip
Wu, Fengshun
Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
description Carbon nanotubes (CNTs) with three different diameter ranges (10–20, 40–60, and 60–100 nm) were doped into tin-silver-copper (SAC) solder, to study the performance of the composite SAC-CNTs solder materials – as well as the effect of the size of the CNTs. It was found that all the CNTs-doped composite solder samples displayed refined microstructure, inhibited interfacial intermetallic compound (IMC) growth, and reinforced mechanical strength – while the melting point of the composite solder was close to that of the pristine solder. The reinforcement in mechanical strength was due to the doped CNTs pinned at the solder grain boundaries, which acted as second-phase particles that refined the microstructure and increased the dislocation density. The adsorbed CNTs destroyed the integrity of the interfacial IMCs, leading to reduced growth rate. Among these composite solders, CNTs with a diameter of 40–60 nm provided superior performance in refining the microstructure, lowering the IMC growth rate by 30.9% – and reinforcing the ball shear strength by 15.3% and the hardness by 16.1%. This size effect on the performance of composite solders was due to the various surface energy values for CNTs – that led to the agglomeration and adsorption of CNTs in the solder matrix and interfacial IMCs.
format Article
author Zhu, Ze
Chan, Yan-Cheong
Chen, Zhong
Gan, Chee-Lip
Wu, Fengshun
author_facet Zhu, Ze
Chan, Yan-Cheong
Chen, Zhong
Gan, Chee-Lip
Wu, Fengshun
author_sort Zhu, Ze
title Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
title_short Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
title_full Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
title_fullStr Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
title_full_unstemmed Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder
title_sort effect of the size of carbon nanotubes (cnts) on the microstructure and mechanical strength of cnts-doped composite sn0.3ag0.7cu-cnts solder
publishDate 2019
url https://hdl.handle.net/10356/85249
http://hdl.handle.net/10220/49190
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