Enhanced copper micro/nano-particle mixed paste sintered at low temperature for 3D interconnects

• المؤلفون الرئيسيون: Gan, Chee Lip, Tan, Chuan Seng, Dai, Y. Y., Ng, M. Z., Anantha, P., Lin, Y. D., Li, Z. G.
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2017
• الموضوعات: Pastes; Nanoparticles
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/86546; http://hdl.handle.net/10220/44098

An enhanced copper paste, formulated by copper micro- and nano-particles mixture, is reported to prevent paste cracking and obtain an improved packing density. The particle mixture of two different sizes enables reduction in porosity of the micro-paste and resolves the cracking issue in the nano-pas...