Silicon wafer microstructure imaging using InfraRed Transport of Intensity Equation

• Main Authors: Li, Hongru, Feng, Guoying, Bourgade, Thomas, Zuo, Chao, Du, Yongzhao, Zhou, Shouhuan, Asundi, Anand
• Other Authors: Quan, Chenggen
• Format: Conference or Workshop Item
• Language: English
• Published: 2018
• Subjects: Infrared Imaging; Phase Retrieval; DRNTU::Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/89429; http://hdl.handle.net/10220/47087
• Institution: Nanyang Technological University

A novel quantitative 3D imaging system of silicon microstructures using InfraRed Transport of Intensity Equation (IRTIE) is proposed in this paper. By recording the intensity at multiple planes and using FFT or DCT based TIE solver, fast and accurate phase retrieval for both uniform and non-uniform...