Silicon wafer microstructure imaging using InfraRed Transport of Intensity Equation

A novel quantitative 3D imaging system of silicon microstructures using InfraRed Transport of Intensity Equation (IRTIE) is proposed in this paper. By recording the intensity at multiple planes and using FFT or DCT based TIE solver, fast and accurate phase retrieval for both uniform and non-uniform...

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Main Authors: Li, Hongru, Feng, Guoying, Bourgade, Thomas, Zuo, Chao, Du, Yongzhao, Zhou, Shouhuan, Asundi, Anand
其他作者: Quan, Chenggen
格式: Conference or Workshop Item
語言:English
出版: 2018
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在線閱讀:https://hdl.handle.net/10356/89429
http://hdl.handle.net/10220/47087
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