Hydrogen bond and surface stress relaxation by aldehydic and formic acidic molecular solvation

• المؤلفون الرئيسيون: Chen, Jiasheng, Yao, Chuang, Zhang, Xi, Sun, Chang Q., Huang, Yongli
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2019
• الموضوعات: Solvation; Hydrogen Bond; DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/90267; http://hdl.handle.net/10220/48501

Solvation of aldehydes and formic acids has an important impact to health care because these additives can damage DNA and denature proteins causing cancers with the mechanism behind remaining great challenge. From the perspective of solvent hydrogen bond (O:HO or HB with “:” being the electron lone...