Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages

• Main Authors: Kor, H. B., Chang, A. C. K., Gan, C. L.
• Other Authors: School of Materials Science & Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/94719; http://hdl.handle.net/10220/8186
• Institution: Nanyang Technological University

Ablation was carried out on high voltage Schottky rectifiers at 25°C and -5°C (with a thermoelectric cooler or TEC), at 1.0 W and 3.9 W of laser power. In-situ measurement of the reverse current was conducted and correlated to the device junction temperature. It was found that the usage of a TEC increases the number of laser scans to reach the set current compliance of 100 μA after exposing the die, for ablation at 3.9 W, although eventual damage to the device is still unavoidable. The incorporation of a TEC below the sample is also demonstrated to be effective in reducing the device junction temperature during laser ablation.