Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints

• المؤلفون الرئيسيون: Nai, S. M. L., Xu, L. Y., Wei, J., Jing, Hongyang, Tan, Cher Ming, Han, Yongdian
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/96171; http://hdl.handle.net/10220/18065

In this study, varying weight percentages of Ni-coated carbon nanotubes (Ni-CNTs) were incorporated into Sn-Ag-Cu (SAC) solder matrix, to form composite solder. Up to 0.05% of Ni-CNTs were successfully incorporated. The interfacial microstructure and shear strength of solders on Ni/Au-finished Cu su...