Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integration

• المؤلفون الرئيسيون: Peng, L., Zhang, L., Li, H.Y., Lim, Dau Fatt, Tan, Chuan Seng
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/96666; http://hdl.handle.net/10220/17912
• المؤسسة: Nanyang Technological University

Electroplated copper (Cu) films are often annealed during back-end processes to stabilize grain growth in order to improve their electrical properties. The effect of prebonding anneal and hence the effective initial grain size of the Cu films on the final bond quality are studied using a 300-nm-thic...