Interdependent intermetallic compound growth in an electroless Ni-P/Sn-3.5Ag reaction couple
The interfacial microstructure of electroless Ni-P/Sn-3.5Ag solder joints was investigated after reflow and high-temperature solid-state aging to understand its interdependent growth mechanism and related kinetics of intermetallic compounds (IMCs) at the interface. The reflow and aging results showe...
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| Main Authors: | , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
2013
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| 在線閱讀: | https://hdl.handle.net/10356/97131 http://hdl.handle.net/10220/10434 |
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