Titanium–aluminum–polytetrafluoroethylene coated stainless steel micromold via co-sputtering deposition : replication performance and limitation in hot-embossing
Stainless steel micromold is an alternative of silicon (Si) micromold in the fabrication of polymeric microfluidic devices because of the brittleness and short lifetime of Si mold. High adhesion and friction of stainless steel micromold can cause the distortion of the microstructures of polymeric pr...
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Main Authors: | Hardt, David E., Chun, Jung H., Saha, Biswajit, Tor, Shu Beng, Liu, Erjia |
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Other Authors: | School of Mechanical and Aerospace Engineering |
Format: | Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/97621 http://hdl.handle.net/10220/12072 |
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Institution: | Nanyang Technological University |
Language: | English |
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