Analysis of coatings which inhibit epoxy bleeding in electronic packaging
Journal of Materials Science: Materials in Electronics
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2014
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sg-nus-scholar.10635-1069622015-01-30T19:17:08Z Analysis of coatings which inhibit epoxy bleeding in electronic packaging Tan, N.X. Lim, K.H.H. Bourdillon, A.J. MATERIALS SCIENCE Journal of Materials Science: Materials in Electronics 8 2 73-77 2014-10-29T08:37:35Z 2014-10-29T08:37:35Z 1997 Article Tan, N.X.,Lim, K.H.H.,Bourdillon, A.J. (1997). Analysis of coatings which inhibit epoxy bleeding in electronic packaging. Journal of Materials Science: Materials in Electronics 8 (2) : 73-77. ScholarBank@NUS Repository. 09574522 http://scholarbank.nus.edu.sg/handle/10635/106962 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| description |
Journal of Materials Science: Materials in Electronics |
| author2 |
MATERIALS SCIENCE |
| author_facet |
MATERIALS SCIENCE Tan, N.X. Lim, K.H.H. Bourdillon, A.J. |
| format |
Article |
| author |
Tan, N.X. Lim, K.H.H. Bourdillon, A.J. |
| spellingShingle |
Tan, N.X. Lim, K.H.H. Bourdillon, A.J. Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| author_sort |
Tan, N.X. |
| title |
Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| title_short |
Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| title_full |
Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| title_fullStr |
Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| title_full_unstemmed |
Analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| title_sort |
analysis of coatings which inhibit epoxy bleeding in electronic packaging |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/106962 |
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1681093558420897792 |