Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique

10.1111/j.1475-1305.2007.00355.x

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Bibliographic Details
Main Authors:	Su, F., Liu, L., Wang, T.
Other Authors:	TEMASEK LABORATORIES
Format:	Article
Published:	2014
Subjects:	Finite element Flip chip Moiré interferometry Residual stress
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/111396
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-111396
record_format	dspace
spelling	sg-nus-scholar.10635-1113962023-10-26T09:20:57Z Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique Su, F. Liu, L. Wang, T. TEMASEK LABORATORIES Finite element Flip chip Moiré interferometry Residual stress 10.1111/j.1475-1305.2007.00355.x Strain 43 4 289-298 STRNB 2014-11-28T01:51:44Z 2014-11-28T01:51:44Z 2007-11 Article Su, F., Liu, L., Wang, T. (2007-11). Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique. Strain 43 (4) : 289-298. ScholarBank@NUS Repository. https://doi.org/10.1111/j.1475-1305.2007.00355.x 00392103 http://scholarbank.nus.edu.sg/handle/10635/111396 000250011600002 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Finite element Flip chip Moiré interferometry Residual stress
spellingShingle	Finite element Flip chip Moiré interferometry Residual stress Su, F. Liu, L. Wang, T. Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
description	10.1111/j.1475-1305.2007.00355.x
author2	TEMASEK LABORATORIES
author_facet	TEMASEK LABORATORIES Su, F. Liu, L. Wang, T.
format	Article
author	Su, F. Liu, L. Wang, T.
author_sort	Su, F.
title	Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
title_short	Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
title_full	Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
title_fullStr	Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
title_full_unstemmed	Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
title_sort	evaluation of residual stress in flip chip using 3-d optical interferometry/fem hybrid technique
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/111396
_version_	1781788977416634368

Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique

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