Evaluation of residual stress in flip chip using 3-D optical interferometry/FEM hybrid technique
10.1111/j.1475-1305.2007.00355.x
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/111396 |
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| Institution: | National University of Singapore |