Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

10.1109/TADVP.2005.847898

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Bibliographic Details
Main Authors: Yin, W.-Y., Dong, X.T.
Other Authors: TEMASEK LABORATORIES
Format: Article
Published: 2014
Subjects:
Average power handling capability (APHC)
Loss tangent
Microstrip interconnects (MIs)
Ohmic attenuation constant
Polyimide
Thermal conductivity
Online Access:http://scholarbank.nus.edu.sg/handle/10635/111509
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/111509

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