Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

10.1109/TADVP.2005.847898

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Main Authors: Yin, W.-Y., Dong, X.T.
Other Authors: TEMASEK LABORATORIES
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/111509
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spelling sg-nus-scholar.10635-1115092023-10-29T23:07:40Z Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates Yin, W.-Y. Dong, X.T. TEMASEK LABORATORIES Average power handling capability (APHC) Loss tangent Microstrip interconnects (MIs) Ohmic attenuation constant Polyimide Thermal conductivity 10.1109/TADVP.2005.847898 IEEE Transactions on Advanced Packaging 28 2 328-336 ITAPF 2014-11-28T01:53:03Z 2014-11-28T01:53:03Z 2005-05 Article Yin, W.-Y., Dong, X.T. (2005-05). Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates. IEEE Transactions on Advanced Packaging 28 (2) : 328-336. ScholarBank@NUS Repository. https://doi.org/10.1109/TADVP.2005.847898 15213323 http://scholarbank.nus.edu.sg/handle/10635/111509 000229003700021 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Average power handling capability (APHC)
Loss tangent
Microstrip interconnects (MIs)
Ohmic attenuation constant
Polyimide
Thermal conductivity
spellingShingle Average power handling capability (APHC)
Loss tangent
Microstrip interconnects (MIs)
Ohmic attenuation constant
Polyimide
Thermal conductivity
Yin, W.-Y.
Dong, X.T.
Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
description 10.1109/TADVP.2005.847898
author2 TEMASEK LABORATORIES
author_facet TEMASEK LABORATORIES
Yin, W.-Y.
Dong, X.T.
format Article
author Yin, W.-Y.
Dong, X.T.
author_sort Yin, W.-Y.
title Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
title_short Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
title_full Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
title_fullStr Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
title_full_unstemmed Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates
title_sort wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/gaas substrates
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/111509
_version_ 1781788999100137472