DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS

Ph.D

Saved in:

Bibliographic Details
Main Author:	HO SIOW LING
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2015
Subjects:	Delamination,Interfacial Fracture Mechanics, Microelectronics Packagings, Cohesive Zone Model, Temperature Effects, Three-Dimensional
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/121039
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-121039
record_format	dspace
spelling	sg-nus-scholar.10635-1210392015-09-24T13:37:11Z DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS HO SIOW LING MECHANICAL ENGINEERING TAY AH ONG, ANDREW JOSHI, SHAILENDRA PRAMOD Delamination,Interfacial Fracture Mechanics, Microelectronics Packagings, Cohesive Zone Model, Temperature Effects, Three-Dimensional Ph.D DOCTOR OF PHILOSOPHY 2015-09-23T18:19:25Z 2015-09-23T18:19:25Z 2011-08-18 Thesis HO SIOW LING (2011-08-18). DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/121039 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Delamination,Interfacial Fracture Mechanics, Microelectronics Packagings, Cohesive Zone Model, Temperature Effects, Three-Dimensional
spellingShingle	Delamination,Interfacial Fracture Mechanics, Microelectronics Packagings, Cohesive Zone Model, Temperature Effects, Three-Dimensional HO SIOW LING DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING HO SIOW LING
format	Theses and Dissertations
author	HO SIOW LING
author_sort	HO SIOW LING
title	DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
title_short	DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
title_full	DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
title_fullStr	DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
title_full_unstemmed	DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS
title_sort	delamination in microelectronics packages: with consideration of three-dimensional and rate effects
publishDate	2015
url	http://scholarbank.nus.edu.sg/handle/10635/121039
_version_	1681095716905156608

DELAMINATION IN MICROELECTRONICS PACKAGES: WITH CONSIDERATION OF THREE-DIMENSIONAL AND RATE EFFECTS

Similar Items