Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects

Ph.D

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Main Author:	MUKHERJEE-ROY MOITREYEE
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Photolithography, Dual Damascene, Attenuated, Copper, Resolution, Overlay
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/13576
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-13576
record_format	dspace
spelling	sg-nus-scholar.10635-135762015-01-14T03:28:23Z Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects MUKHERJEE-ROY MOITREYEE ELECTRICAL & COMPUTER ENGINEERING SAMUDRA, GANESH S Photolithography, Dual Damascene, Attenuated, Copper, Resolution, Overlay Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T10:34:23Z 2010-04-08T10:34:23Z 2004-01-15 Thesis MUKHERJEE-ROY MOITREYEE (2004-01-15). Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13576 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Photolithography, Dual Damascene, Attenuated, Copper, Resolution, Overlay
spellingShingle	Photolithography, Dual Damascene, Attenuated, Copper, Resolution, Overlay MUKHERJEE-ROY MOITREYEE Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
description	Ph.D
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING MUKHERJEE-ROY MOITREYEE
format	Theses and Dissertations
author	MUKHERJEE-ROY MOITREYEE
author_sort	MUKHERJEE-ROY MOITREYEE
title	Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
title_short	Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
title_full	Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
title_fullStr	Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
title_full_unstemmed	Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
title_sort	solutions to pattern transfer issues in fabrication of copper dual damascene interconnects
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/13576
_version_	1681078881393573888

Solutions to pattern transfer issues in fabrication of copper dual damascene interconnects

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