Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing

Ph.D

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Bibliographic Details
Main Author:	TAN CHENG CHEH, DENNIS
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	titanium silicide interconnect C49 C54 TiSi2
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/14027
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-14027
record_format	dspace
spelling	sg-nus-scholar.10635-140272015-03-28T10:43:43Z Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing TAN CHENG CHEH, DENNIS MECHANICAL ENGINEERING LU LI titanium silicide interconnect C49 C54 TiSi2 Ph.D DOCTOR OF PHILOSOPHY 2010-04-08T10:39:07Z 2010-04-08T10:39:07Z 2004-05-29 Thesis TAN CHENG CHEH, DENNIS (2004-05-29). Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/14027 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	titanium silicide interconnect C49 C54 TiSi2
spellingShingle	titanium silicide interconnect C49 C54 TiSi2 TAN CHENG CHEH, DENNIS Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
description	Ph.D
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING TAN CHENG CHEH, DENNIS
format	Theses and Dissertations
author	TAN CHENG CHEH, DENNIS
author_sort	TAN CHENG CHEH, DENNIS
title	Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
title_short	Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
title_full	Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
title_fullStr	Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
title_full_unstemmed	Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
title_sort	application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/14027
_version_	1681078957686915072

Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing

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