Application of titanium silicide as an interconnect in deep submicron integrated chip manufacturing
Ph.D
Saved in:
Main Author: | TAN CHENG CHEH, DENNIS |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Theses and Dissertations |
Language: | English |
Published: |
2010
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/14027 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Language: | English |
Similar Items
-
Characterization of titanium silicide by Raman spectroscopy for submicron IC processing
by: Lim, E.H., et al.
Published: (2014) -
Structural and mechanism studies of laser induced titanium disilicide
by: TAN SWEE CHING
Published: (2010) -
Structure of Co deposited 6H-SiC(0 0 0 1)
by: Chen, W., et al.
Published: (2014) -
Synthesis of pure C40 TiSi2 for Si wafer fabrication
by: Chen, S.Y., et al.
Published: (2014) -
Surface and interface studies of titanium silicide formation
by: Wee, A.T.S., et al.
Published: (2014)