HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES

Ph.D

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Bibliographic Details
Main Author:	LIN TINGYU
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/153003
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-153003
record_format	dspace
spelling	sg-nus-scholar.10635-1530032020-11-19T13:57:33Z HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES LIN TINGYU MECHANICAL & PRODUCTION ENGINEERING A. A. O. TAY Ph.D DOCTOR OF PHILOSOPHY 2019-04-09T09:47:16Z 2019-04-09T09:47:16Z 1999 Thesis LIN TINGYU (1999). HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/153003 CCK BATCHLOAD 20190405
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Ph.D
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING LIN TINGYU
format	Theses and Dissertations
author	LIN TINGYU
spellingShingle	LIN TINGYU HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
author_sort	LIN TINGYU
title	HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
title_short	HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
title_full	HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
title_fullStr	HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
title_full_unstemmed	HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES
title_sort	hygrothermally-induced delamination and cracking in plastic ic packages
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/153003
_version_	1686108194913386496

HYGROTHERMALLY-INDUCED DELAMINATION AND CRACKING IN PLASTIC IC PACKAGES

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