OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE

OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE

Master's

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Bibliographic Details
Main Author: TEO SEH KIAT
Other Authors: SINGAPORE-MIT ALLIANCE
Format: Theses and Dissertations
Published: 2019
Subjects:
Yield
Cleaning Frequency
Lead-free
BGA
QFN
Pin
Modulus
Hardness
Grain Size
Reactivity
Resistance
Chemical Analysis
Phase Analysis
Online Access:https://scholarbank.nus.edu.sg/handle/10635/154063
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Institution: National University of Singapore
id sg-nus-scholar.10635-154063
record_format dspace
spelling sg-nus-scholar.10635-1540632019-05-13T13:11:15Z OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE TEO SEH KIAT SINGAPORE-MIT ALLIANCE WONG CHEE CHEONG MEL GOODSON LIM KOK HWA SIM YEOW TECK Yield Cleaning Frequency Lead-free BGA QFN Pin Modulus Hardness Grain Size Reactivity Resistance Chemical Analysis Phase Analysis Master's MASTER OF SCIENCE IN ADVANCED MATERIALS FOR MICRO- & NANO- SYSTEMS 2019-05-13T07:56:42Z 2019-05-13T07:56:42Z 2006 Thesis TEO SEH KIAT (2006). OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/154063 SMA BATCHLOAD 20190422
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Yield
Cleaning Frequency
Lead-free
BGA
QFN
Pin
Modulus
Hardness
Grain Size
Reactivity
Resistance
Chemical Analysis
Phase Analysis
spellingShingle Yield
Cleaning Frequency
Lead-free
BGA
QFN
Pin
Modulus
Hardness
Grain Size
Reactivity
Resistance
Chemical Analysis
Phase Analysis
TEO SEH KIAT
OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
description Master's
author2 SINGAPORE-MIT ALLIANCE
author_facet SINGAPORE-MIT ALLIANCE
TEO SEH KIAT
format Theses and Dissertations
author TEO SEH KIAT
author_sort TEO SEH KIAT
title OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
title_short OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
title_full OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
title_fullStr OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
title_full_unstemmed OPTIMUM MATERIAL COMPOSITION FOR CONTACTING INTERFACE IN TESTING OF LEAD-FREE DEVICE
title_sort optimum material composition for contacting interface in testing of lead-free device
publishDate 2019
url https://scholarbank.nus.edu.sg/handle/10635/154063
_version_ 1681099332793663488

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