ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING

ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING

Master's

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Bibliographic Details
Main Author: NG WEI CHIN
Other Authors: CIVIL ENGINEERING
Format: Theses and Dissertations
Published: 2019
Subjects:
UBM
EN
zincation
acid stripping
bond pads
surface morphology
Online Access:https://scholarbank.nus.edu.sg/handle/10635/158871
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Institution: National University of Singapore
id sg-nus-scholar.10635-158871
record_format dspace
spelling sg-nus-scholar.10635-1588712024-04-03T06:40:23Z ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING NG WEI CHIN CIVIL ENGINEERING KO TZE-MAN UBM EN zincation acid stripping bond pads surface morphology Master's MASTER OF ENGINEERING 2019-09-16T02:41:34Z 2019-09-16T02:41:34Z 2000 Thesis NG WEI CHIN (2000). ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/158871 CCK BATCHLOAD 20190911
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic UBM
EN
zincation
acid stripping
bond pads
surface morphology
spellingShingle UBM
EN
zincation
acid stripping
bond pads
surface morphology
NG WEI CHIN
ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
description Master's
author2 CIVIL ENGINEERING
author_facet CIVIL ENGINEERING
NG WEI CHIN
format Theses and Dissertations
author NG WEI CHIN
author_sort NG WEI CHIN
title ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_short ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_full ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_fullStr ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_full_unstemmed ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_sort zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging
publishDate 2019
url https://scholarbank.nus.edu.sg/handle/10635/158871
_version_ 1795374075076411392

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