ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING

Master's

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Bibliographic Details
Main Author:	NG WEI CHIN
Other Authors:	DEPT OF CIVIL ENGINEERING
Format:	Theses and Dissertations
Published:	2019
Subjects:	UBM EN zincation acid stripping bond pads surface morphology
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/160185
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-160185
record_format	dspace
spelling	sg-nus-scholar.10635-1601852019-10-18T05:49:13Z ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING NG WEI CHIN DEPT OF CIVIL ENGINEERING KO TZE-MAN UBM EN zincation acid stripping bond pads surface morphology Master's MASTER OF ENGINEERING 2019-10-18T05:49:13Z 2019-10-18T05:49:13Z 2000 Thesis NG WEI CHIN (2000). ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/160185 CCK BATCHLOAD 20190911
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	UBM EN zincation acid stripping bond pads surface morphology
spellingShingle	UBM EN zincation acid stripping bond pads surface morphology NG WEI CHIN ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
description	Master's
author2	DEPT OF CIVIL ENGINEERING
author_facet	DEPT OF CIVIL ENGINEERING NG WEI CHIN
format	Theses and Dissertations
author	NG WEI CHIN
author_sort	NG WEI CHIN
title	ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_short	ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_full	ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_fullStr	ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_full_unstemmed	ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING
title_sort	zincation pretreatment for electroless nickel underbump metallurgy in microelectronics packaging
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/160185
_version_	1681100028409544704

ZINCATION PRETREATMENT FOR ELECTROLESS NICKEL UNDERBUMP METALLURGY IN MICROELECTRONICS PACKAGING

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