Patterning and adhesion characterization of mettalization for a microelectronics packaging application

Master's

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Bibliographic Details
Main Author:	TAN AIPING
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2019
Subjects:	surface modification; copper micro-patterning; adhesion; release layer; bump shear test ; die pull test.
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/161061
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-161061
record_format	dspace
spelling	sg-nus-scholar.10635-1610612019-11-01T13:17:15Z Patterning and adhesion characterization of mettalization for a microelectronics packaging application TAN AIPING MECHANICAL ENGINEERING TAY AH ONG, ANDREW surface modification; copper micro-patterning; adhesion; release layer; bump shear test ; die pull test. Master's MASTER OF ENGINEERING 2019-10-31T18:05:02Z 2019-10-31T18:05:02Z 2005-01-26 Thesis TAN AIPING (2005-01-26). Patterning and adhesion characterization of mettalization for a microelectronics packaging application. ScholarBank@NUS Repository. https://scholarbank.nus.edu.sg/handle/10635/161061 en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	surface modification; copper micro-patterning; adhesion; release layer; bump shear test ; die pull test.
spellingShingle	surface modification; copper micro-patterning; adhesion; release layer; bump shear test ; die pull test. TAN AIPING Patterning and adhesion characterization of mettalization for a microelectronics packaging application
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING TAN AIPING
format	Theses and Dissertations
author	TAN AIPING
author_sort	TAN AIPING
title	Patterning and adhesion characterization of mettalization for a microelectronics packaging application
title_short	Patterning and adhesion characterization of mettalization for a microelectronics packaging application
title_full	Patterning and adhesion characterization of mettalization for a microelectronics packaging application
title_fullStr	Patterning and adhesion characterization of mettalization for a microelectronics packaging application
title_full_unstemmed	Patterning and adhesion characterization of mettalization for a microelectronics packaging application
title_sort	patterning and adhesion characterization of mettalization for a microelectronics packaging application
publishDate	2019
url	https://scholarbank.nus.edu.sg/handle/10635/161061
_version_	1681100159108251648

Patterning and adhesion characterization of mettalization for a microelectronics packaging application

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