Investigation of adhesion mechanism and pore-sealing layer between tantalum barrier layer and porous SiLK

Master's

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Bibliographic Details
Main Author:	HU YUE
Other Authors:	PHYSICS
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	SiLK, Ultra-low-k, dielectrics, PECVD, DFT, pore-sealing
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/16949
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Institution:	National University of Singapore
Language:	English

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