Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers

Master's

محفوظ في:

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	HE TAO
مؤلفون آخرون:	MECHANICAL ENGINEERING
التنسيق:	Theses and Dissertations
اللغة:	English
منشور في:	2010
الموضوعات:	wafer fabrication; ductile mode cutting; chip formation mechanism; critical chip thickness; atomistic model; tool wear;
الوصول للمادة أونلاين:	http://scholarbank.nus.edu.sg/handle/10635/17005
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
المؤسسة:	National University of Singapore
اللغة:	English

id	sg-nus-scholar.10635-17005
record_format	dspace
spelling	sg-nus-scholar.10635-170052024-10-25T14:41:39Z Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers HE TAO MECHANICAL ENGINEERING LI XIAOPING RAHMAN, MUSTAFIZUR wafer fabrication; ductile mode cutting; chip formation mechanism; critical chip thickness; atomistic model; tool wear; Master's MASTER OF ENGINEERING 2010-05-13T19:27:25Z 2010-05-13T19:27:25Z 2005-03-22 Thesis HE TAO (2005-03-22). Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/17005 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
language	English
topic	wafer fabrication; ductile mode cutting; chip formation mechanism; critical chip thickness; atomistic model; tool wear;
spellingShingle	wafer fabrication; ductile mode cutting; chip formation mechanism; critical chip thickness; atomistic model; tool wear; HE TAO Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING HE TAO
format	Theses and Dissertations
author	HE TAO
author_sort	HE TAO
title	Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
title_short	Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
title_full	Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
title_fullStr	Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
title_full_unstemmed	Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
title_sort	atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/17005
_version_	1821224011404673024

Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers

مواد مشابهة